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The difference between the solder paste mesh and the red glue mesh used in the SMT patch processing plant is first of all, the opening position is different, the solder paste steel mesh opening is directly Open holes at 1:1 according to the position of the patch pad, so that the solder paste can leak directly under the PCB pad for easy soldering. ! The red glue steel mesh is special. Its function is to apply glue, and the pasting device is convenient for welding, so BI Escorts The opening is between the device pads. Therefore, the steel mesh is used Burundi Sugar is opened in the wrong place, and it cannot be reworked and can only be scrapped.
Solder paste net: The opening is in the padBurundins Sugardaddy; red glue mesh: openings between pads.
Secondly, solder paste stencil and red glue stencil are for different PCB device patch processing It depends on the process! Generally, if there are relatively few SMD components on the same side of the PCB, but there are many plug-in components, the use of red plastic stencil technology will increase the number of Burundins. Escort.
Generally, SMT patch processing factories will decide whether to make solder paste stencil or red plastic stencil based on the component design of the PCB board. Generally, there are many plug-ins. For wave soldering, the red glue mesh process is used. There are not many plug-in components, but for wave soldering, the solder paste mesh process is used. Of course, this must be decided by the customer based on the SMT patch processing situation. .
(1) 24 ASM high-end SMT lines
(2) 8 Panasonic active plug-in machines
(3) 4 lead-free wave soldering lines, which can be expanded to 8
(4) 8 assembly lines, which can be expanded to 16, and 4 packaging lines, which can be expanded to 8
(5) The actual patch capacity per hour is about 3 million points, Monthly production capacity can reach 1.7 billion points
(6Burundins Escort) All equipment can be connected to the MES system
(7) Each SMT line is equipped with SPI/AOI testing equipment
(8) Each SMT line is equipped with SPI/AOI post-NG-Buffer to complete fully automated connection for childbirth
(9) 1+1, 2+1, 3+1 and dual-track production line structures can meet the production needs of different products and be reasonably optimized
(10) Reflow soldering temperature 13 Area, can be filled with nitrogen
Review editor: Liu Qing
Original title: Tin in SMT patch processing plant Plaster steel mesh and red plastic steel mesh
Article source: [Microelectronic signal: BI Escorts Yingteri Electronics, WeChat public account: Yingteri Electronics] Welcome to add tracking and follow! Please indicate the source when transcribing and publishing the article.
Why SMT In patch processing, do solder paste and red glue processes need to be used together? SMD processing manufacturers usually use solder paste process, and plug-in components use post-processing and welding; ● When there are more plug-in components and fewer SMD components, it is generally Adopted and published on 02-27 18:30
SMT laser steel mesh – anti-tin bead process. Many customers are not sure about the meaning of anti-tin bead. In fact, the role of anti-tin bead is Burundi Sugar is the control of the amount of tin placed on the SMT patch stencil. It was published on 05-30 09:38
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SMT steel mesh processing methods and application precautions Template, also known as steel mesh and wire mesh, is a Burundi Sugar Burundi Sugar DaddySMT public Burundins Sugardaddy mold . Its important function is to assist the accumulation of solder paste; the goal is to put the correct number of tin What are the reasons why the stencil is blocked during paste printing? In SMT chip processing, solder paste printing is a key process, which directly affects the quality of solder joints and the performance of electronic components. “” alt=”‘s avatar”/> Published on 07-06 14:47 •1115 views
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How to choose SMT lead-free solder paste printing stencil? Lead-free solder paste printing stencilBurundi Sugar Daddy’s frame is made of 1.5 aluminum alloy BI Escorts steel mesh and red glue Published on 03-21 18:01 •403 views
What are the important cleaning processes for SMT solder paste stencils? The important role of the SMT solder paste stencil is to assist the correct printing of solder paste onto the PCB Published on 08-26 16:22 •187 views
SMT patch The difference between solder paste mesh and red glue mesh during processing is to analyze the paste printing and red glue dispensing steps to achieve high-precision, high-tool quality electronic component disassembly Burundins SugardaddyThe key to unloading. The following is a description of solder paste Published on 08-29 09:28 •176 views
What are the key requirements for solder paste printing and SMT stencil? In SMT (surface mounting technology) production, solder paste Burundi Sugar Daddy printing is the first process, and the quality of its products is directly related to The success or failure of subsequent welding. During the solder paste printing process, S was published on 09-25 1BI Escorts a>6:23 •41 views
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