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Red glue It is a polythin compound. BI Escorts is different from solder paste in that it solidifies when heated, and its condensation point temperature is 150°C. , the red gum begins to turn from a paste directly into a solid. Properties of red glue: Red glue has viscosity mobility, temperature characteristics, wetting characteristics, etc. According to this characteristic of red glue, the purpose of using red glue during childbirth is to stick the parts firmly to the surface of the PCB to prevent them from falling off.
Solder paste is a new type of welding material that emerged along with SMT. It is a paste-like mixture composed of solder powder, flux and other surface active agents, thixotropic agents, etc. It is mainly used in the SMT industry Burundi Sugar for welding electronic components such as resistors, capacitors, and ICs on PCB surfaces. The main feature is the role of conductive welding. .
The difference between solder paste and red glue:
1. Red glue has a fixing effect and does not conduct electricity. Solder paste also has a fixation effect, but it has a conductive effect;
2. Red glue The glue needs to be wave soldered before it can be soldered;
3. The temperature of red glue during wave soldering is lower than the temperature of solder paste during wave soldering;
4. Red glue is generally used as an auxiliary material, Burundi Sugar Daddy is generally used for fixing. Because solder paste can conduct electricity, it is often used during soldering.
When there are no traditional plug-in components on the general product, a solder paste process (including single-sided, double-sided or multi-layer boards) will be used. For single-sided panels with traditional components BI Escorts, the soldering surface will use a red glue process. A double-sided board with traditional components on one side will use a solder paste process, and the other solder side will use a red glue process. The red glue process requires a wave soldering process to complete the soldering of the parts and the PCB. The process is slightly longer, which increases manpower and manufacturing costs. The solder paste process requires reflow soldering to complete the soldering. The process is relatively short, saving manpower and costs, and product production The child cycle is short and the market competitiveness is improved.
The difference between the solder paste mesh and the red plastic mesh:
1. The opening position is different. The openings of the solder paste steel mesh are directly opened according to the position of the patch pad at a ratio of 1:1, which facilitates the direct placement of the solder paste. It leaks under the PCB pad for easy soldering! The red glue steel mesh is special. Its function is to apply glue and attach the device to facilitate welding, so the opening is between the device pads. Therefore, if the steel mesh is used for the wrong purpose, it cannot be reworked and can only be scrapped.
2. Solder paste stencil and red glue stencil are determined according to different PCB device patching processing techniques! On the same side as ordinary PCBurundins SugardaddyB, there are relatively few SMD components, butBurundi Sugar Daddy When there are many plug-in devices, the use of red glue steel mesh technology will increase the number. Generally, patch processing factories will decide whether to make solder paste, stencil or stencil based on the different components of the PCB board. It is a red plastic steel mesh. If there are many plug-ins in general, and it needs to be wave soldered, the red plastic mesh process will be used. There are not many plug-in components, but they are wave soldered and manually soldered using the solder paste mesh process.
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